Invention Grant
- Patent Title: Coil device
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Application No.: US15358838Application Date: 2016-11-22
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Publication No.: US10748699B2Publication Date: 2020-08-18
- Inventor: Susumu Tokura , Akio Ueda , Jun Araki
- Applicant: IHI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: IHI CORPORATION
- Current Assignee: IHI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2c3c001
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F27/28 ; H02J50/12 ; H02J50/70 ; H01F27/36 ; H01F38/14 ; H02J7/02 ; H02J50/10 ; B60L53/12 ; H01F27/02 ; H01F27/32 ; B60L5/00 ; H02J7/00

Abstract:
A coil device of solenoid type includes a coil portion having a bobbin and a conductive wire wound around the bobbin, a housing for accommodating the coil portion, and at least one fastener for fastening the bobbin and the housing. The conductive wire includes a plurality of extending portions extending along a wound wire direction on the bobbin and having gaps in a winding axis direction, and the coil portion includes an enlarged portion in which a gap between extending portions adjacent to each other in the winding axis direction is wider than a gap between other extending portions. The fastener is provided in the enlarged portion.
Public/Granted literature
- US20170076854A1 COIL DEVICE Public/Granted day:2017-03-16
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