Invention Grant
- Patent Title: Inductor device
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Application No.: US15975753Application Date: 2018-05-09
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Publication No.: US10748701B2Publication Date: 2020-08-18
- Inventor: Hsiao-Tsung Yen , Cheng-Wei Luo , Yuh-Sheng Jean , Ta-Hsun Yeh
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@197d0586
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/34 ; H01F27/29 ; H01F17/00

Abstract:
An inductor device includes a first and a second inductor unit. The first inductor unit includes a first and a second wire. The first wire is winded to form circles. The second wire is winded with the first wire to form circles. The first and/or the second wire are winded in an interlaced manner at a first terminal, a second terminal, a first side, and a second side. The second inductor unit includes a third and a fourth wire. The third wire is winded to form circles. The fourth wire is winded with the third wire to form circles. The third and/or the fourth wire are winded in an interlaced manner at a third terminal, a fourth terminal, a third side, and a fourth side. The first wired is coupled to the fourth wired, and the second wired is coupled to the third wired.
Public/Granted literature
- US20180330872A1 INDUCTOR DEVICE Public/Granted day:2018-11-15
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