Invention Grant
- Patent Title: Integrated mechanical device with vertical movement
-
Application No.: US16222017Application Date: 2018-12-17
-
Publication No.: US10748726B2Publication Date: 2020-08-18
- Inventor: Christian Rivero , Pascal Fornara , Antonio Di-Giacomo , Brice Arrazat
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Agency: Slater Matsil, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78ddbe7c
- Main IPC: H01H1/58
- IPC: H01H1/58 ; H01H61/02 ; H01H9/02 ; B81B3/00
Abstract:
A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.
Public/Granted literature
- US20190122845A1 INTEGRATED MECHANICAL DEVICE WITH VERTICAL MOVEMENT Public/Granted day:2019-04-25
Information query
