Invention Grant
- Patent Title: Microelectromechanical light emitter component, light emitter component and method for producing a microelectromechanical light emitter component
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Application No.: US16186678Application Date: 2018-11-12
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Publication No.: US10748732B2Publication Date: 2020-08-18
- Inventor: Matthias Eberl , Franz Jost , Stefan Kolb
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1733bab
- Main IPC: H01J19/78
- IPC: H01J19/78 ; H01J19/54
Abstract:
A microelectromechanical light emitter component comprises an emitter layer structure of the microelectromechanical light emitter component and an inductive structure of the microelectromechanical light emitter component. The inductive structure of the microelectromechanical light emitter component is configured to generate current in the emitter layer structure by electromagnetic induction, such that the emitter layer structure emits light. The emitter layer structure is electrically insulated from the inductive structure.
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