Power management application of interconnect substrates

Invention Grant

US10748845B2 Power management application of interconnect substrates 有权

Patent Title: Power management application of interconnect substrates
Application No.: US16405406

Application Date: 2019-05-07
Publication No.: US10748845B2

Publication Date: 2020-08-18
Inventor: Mihalis Michael , Kwang Hong Tan , Ilija Jergovic , Chiteh Chiang , Anthony Stratakos
Applicant: Volterra Semiconductor Corporation
Applicant Address: US CA Fremont
Assignee: Volterra Semiconductor Corporation
Current Assignee: Volterra Semiconductor Corporation
Current Assignee Address: US CA Fremont
Agency: Weaver Austin Villeneuve & Sampson LLP
Main IPC: H01L23/495
IPC: H01L23/495 ; H01L23/498 ; H01L23/50 ; H01L21/56 ; H01L23/00 ; H01L23/36 ; H01L23/522 ; H01L23/528 ; H01L23/367 ; H01L23/31 ; H01L25/10

Abstract:

Various applications of interconnect substrates in power management systems are described.

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置
H01L23/488	..由焊接或黏结结构组成
H01L23/495	...引线框架的