Invention Grant
- Patent Title: Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
-
Application No.: US13343651Application Date: 2012-01-04
-
Publication No.: US10748867B2Publication Date: 2020-08-18
- Inventor: Ryan B. Wicker , Eric MacDonald , Francisco Medina , David Espalin , Danny W. Muse
- Applicant: Ryan B. Wicker , Eric MacDonald , Francisco Medina , David Espalin , Danny W. Muse
- Applicant Address: US TX Austin
- Assignee: Board of Regents, The University of Texas System
- Current Assignee: Board of Regents, The University of Texas System
- Current Assignee Address: US TX Austin
- Agency: Yee & Associates, P.C.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/46 ; H01L21/02 ; H01L23/00 ; B33Y10/00 ; B33Y70/00 ; B33Y80/00 ; B29C70/72 ; H05K1/18 ; H01L21/48 ; B29C64/106 ; H05K3/40 ; H05K1/02 ; H05K3/00
Abstract:
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
Public/Granted literature
Information query
