Invention Grant
- Patent Title: Integrated wafer-level processing system
-
Application No.: US16369390Application Date: 2019-03-29
-
Publication No.: US10748877B2Publication Date: 2020-08-18
- Inventor: Philip G. Emma , Hillery C. Hunter , John U. Knickerbocker
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent L. Jeffrey Kelly
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00 ; G11C29/00 ; G11C29/56 ; H01L23/498 ; H01L23/367 ; H01L23/544 ; G02B6/122 ; H01L25/18 ; H01L21/78 ; G11C29/52 ; G11C11/401 ; G11C29/42

Abstract:
Examples of techniques for an integrated wafer-level processing system are disclosed. In one example implementation according to aspects of the present disclosure, an integrated wafer-level processing system includes a memory wafer and a processing element connected to the memory wafer via a data connection.
Public/Granted literature
- US20190229095A1 INTEGRATED WAFER-LEVEL PROCESSING SYSTEM Public/Granted day:2019-07-25
Information query
IPC分类: