Invention Grant
- Patent Title: Epitaxial source and drain structures for high voltage devices
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Application No.: US15715541Application Date: 2017-09-26
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Publication No.: US10748899B2Publication Date: 2020-08-18
- Inventor: Yi-Huan Chen , Chien-Chih Chou , Kong-Beng Thei
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/10 ; H01L29/08 ; H01L29/78 ; H01L29/06

Abstract:
An integrated circuit having an epitaxial source and drain, which reduces gate burnout and increases switching speed so that is suitable for high voltage applications, is provided. The integrated circuit includes a semiconductor substrate having a high voltage N-well (HVNW) and a high voltage P-well (HVPW). The integrated circuit further includes a high-voltage device on the semiconductor substrate. The high-voltage device includes an epitaxial p-type source disposed in the HVNW, an epitaxial p-type drain disposed in the HVPW, and a gate arranged between the epitaxial p-type source and the epitaxial p-type drain on a surface of the semiconductor substrate.
Public/Granted literature
- US20190096887A1 EPITAXIAL SOURCE AND DRAIN STRUCTURES FOR HIGH VOLTAGE DEVICES Public/Granted day:2019-03-28
Information query
IPC分类: