Multi-layer random access memory and methods of manufacture
Abstract:
A semiconductor structure for a DRAM is described having multiple layers of arrays of memory cells. Memory cells in a vertical string extending through the layers have an electrical connection to one terminal of the memory cells in that string. Word lines couple the strings together. Each layer of the array also includes bit line connections to memory cells on that layer. Select transistors enable the use of folded bit lines. The memory cells preferably are thyristors. Methods of fabricating the array are described.
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