Invention Grant
- Patent Title: Non-volatile semiconductor memory device and manufacturing method thereof
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Application No.: US16176634Application Date: 2018-10-31
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Publication No.: US10748916B2Publication Date: 2020-08-18
- Inventor: Yoshihiro Akutsu , Ryota Katsumata
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/11556
- IPC: H01L27/11556 ; H01L21/768 ; H01L21/74 ; H01L27/11582 ; H01L27/1157 ; H01L27/11578 ; H01L23/535 ; H01L27/11573 ; H01L25/00

Abstract:
This non-volatile semiconductor memory device includes a memory cell array including NAND cell units formed in a first direction vertical to a surface of a semiconductor substrate. A local source line is electrically coupled to one end of the NAND cell unit formed on the surface of the substrate. The memory cell array includes: a laminated body where plural conductive films, which are to be control gate lines of memory cells or selection gate lines of selection transistors, are laminated sandwiching interlayer insulating films; a semiconductor layer that extends in the first direction; and an electric charge accumulating layer sandwiched between: the semiconductor layer and the conductive film. The local source line includes a silicide layer. The electric charge accumulating layer is continuously formed from the memory cell array to cover a peripheral area of the silicide layer.
Public/Granted literature
- US20190074284A1 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-03-07
Information query
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