Invention Grant
- Patent Title: Integrated inductor apparatus
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Application No.: US16129861Application Date: 2018-09-13
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Publication No.: US10748985B2Publication Date: 2020-08-18
- Inventor: Hsiao-Tsung Yen
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19452537
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/522 ; H01F27/29 ; H01F5/04 ; H01F17/00

Abstract:
An integrated inductor includes a first coil, a second coil, a third coil and a fourth coil. The first coil is disposed on a first layer of an integrated circuit structure. The second coil is disposed on the first layer and adjacent to the first coil, in which the first coil and the second coil have same number of turns. The third coil is disposed on a second layer of the integrated circuit structure and above the first coil. The fourth coil is disposed on the second layer and above the second coil, in which the third coil and the fourth coil have same number of turns. The first coil is coupled to and interlaced with the fourth coil disposed on the second layer. The second coil is coupled to and interlaced with the third coil disposed on the second layer.
Public/Granted literature
- US20190088734A1 INTEGRATED INDUCTOR APPARATUS Public/Granted day:2019-03-21
Information query
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