Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16110332Application Date: 2018-08-23
-
Publication No.: US10749024B2Publication Date: 2020-08-18
- Inventor: Akihiro Tanaka
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: White & Case LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@181ed0d8
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/02 ; H01L27/088 ; H01L29/423 ; H01L29/417 ; H01L29/06 ; H01L23/482

Abstract:
A semiconductor device of an embodiment includes a first region including a first portion of a semiconductor layer having first and second planes, a first trench, a first gate electrode, a first source electrode and a drain electrode; a second region adjacent to the first region in a first direction and including a second portion of the semiconductor layer, a second trench, a second gate electrode, a second source electrode on the first plane side, and the drain electrode; a third region adjacent to the first region in a second direction crossing the first direction and including a third portion of the semiconductor layer, a third trench, a third gate electrode, a third source electrode on the first plane side, and the drain electrode; a first gate electrode pad connected to the first gate electrode; and a second gate electrode pad connected to the second and third gate electrodes.
Public/Granted literature
- US20190296148A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-09-26
Information query
IPC分类: