Invention Grant
- Patent Title: Semiconductor device including a trench structure
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Application No.: US15704413Application Date: 2017-09-14
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Publication No.: US10749043B2Publication Date: 2020-08-18
- Inventor: Katsumi Nakamura
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3cfae1be
- Main IPC: H01L29/861
- IPC: H01L29/861 ; H01L29/739 ; H01L29/08 ; H01L29/36

Abstract:
A semiconductor device having first through third layers. The first layer has a first conductivity type. The second layer has a second conductivity type different from the first conductivity type. The third layer has a first portion having the second conductivity type and a second portion having the first conductivity type. A trench structure is located in the first portion and is completely surrounded by the first portion in an area extending from a first surface of the third layer to a second surface of the third layer.
Public/Granted literature
- US20180006160A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-01-04
Information query
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