Invention Grant
- Patent Title: Sealant for electrochemical device in which non-aqueous electrolysis solution is used and sealant composition for electrochemical device
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Application No.: US16065868Application Date: 2017-01-06
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Publication No.: US10749153B2Publication Date: 2020-08-18
- Inventor: Kouichirou Maeda
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Kenja IP Law PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@763f41c8
- International Application: PCT/JP2017/000269 WO 20170106
- International Announcement: WO2017/119485 WO 20170713
- Main IPC: H01M2/08
- IPC: H01M2/08 ; C08L47/00 ; C08L53/02 ; H01G11/80 ; H01M10/052 ; C09K3/10 ; C08K3/00 ; C08L25/18 ; C08L67/00 ; H01M10/0525 ; H01M10/0566

Abstract:
Provided is a sealant for an electrochemical device in which a non-aqueous electrolysis solution is used that has sufficient sealing performance even with respect to a high-polarity resin. The sealant contains a conjugated diene polymer (A), an aromatic vinyl-conjugated diene block polymer (B), and a hydrogenated amine-modified aromatic vinyl-conjugated diene block polymer (C).
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