Invention Grant
- Patent Title: Controlled-impedance printed-circuit board (PCB) design with stack-up re-mapping
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Application No.: US16102801Application Date: 2018-08-14
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Publication No.: US10750616B2Publication Date: 2020-08-18
- Inventor: Michael A. Christo , Diana D. Zurovetz , David Green
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Peter J. Edwards
- Main IPC: G06F30/394
- IPC: G06F30/394 ; H05K3/00 ; G06F30/398

Abstract:
A controlled-impedance printed circuit board (PCB) design program allows interactive movement of features from one of the vertically-stacked layers of the design to another layer in a graphical interface. The movement either moves a region of a layer of the PCB design, or moves an entire layer in a layer-swapping operation. The program computes modified widths of circuit traces of the first layer of the controlled-impedance printed circuit board design according to an impedance control value of the controlled-impedance printed circuit board design and according to a new position of the circuit traces caused by a movement of the features of the first layer to the second layer. The program also checks for violation of reference plane requirements for critical signals and warns the designer if such a violation is present.
Public/Granted literature
- US20200060026A1 CONTROLLED-IMPEDANCE PRINTED-CIRCUIT BOARD (PCB) DESIGN WITH STACK-UP RE-MAPPING Public/Granted day:2020-02-20
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