Invention Grant
- Patent Title: Immersion cooling infrastructure module having compute device form factor
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Application No.: US16662348Application Date: 2019-10-24
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Publication No.: US10750637B1Publication Date: 2020-08-18
- Inventor: Husam Alissa , Nicholas Andrew Keehn
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Watson Patents, PLC
- Agent Vladan M. Vasiljevic
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A removable immersion cooling infrastructure module can have a form factor equivalent to that of one or more of the computing devices being cooled by immersion cooling, thereby enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner. Moreover, the quantity of immersion cooling infrastructure modules can be varied depending on need, since the immersion cooling infrastructure modules and computing devices can be interchangeable within the openings designed to house the computing devices. An immersion cooling infrastructure module can comprise a filter, a pump that can circulate the immersion cooling liquid through the filter, a power supply and a controller, with the module receiving power, and, optionally, communications and other like connectivity, from the same source as the computing devices.
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