- Patent Title: Method of inserting a surgical implant within a transcorporeal void
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Application No.: US16037671Application Date: 2018-07-17
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Publication No.: US10751192B1Publication Date: 2020-08-25
- Inventor: Robert E. Simonson , David P. Sachs
- Applicant: Robert E. Simonson , David P. Sachs
- Agency: Burr & Forman LLP
- Agent Jeffrey H. Kamenetsky
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30 ; A61F2/46
Abstract:
An implant preshaped before placement anteriorly between a superior endplate and an inferior endplate within a void created by a transcorporeal procedure in a vertebra, the implant having no circular cross-sectional dimension.
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