Invention Grant
- Patent Title: Bonding material, and bonding method and bonded structure each using same
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Application No.: US16015279Application Date: 2018-06-22
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Publication No.: US10751841B2Publication Date: 2020-08-25
- Inventor: Masumi Noguchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@797a55fb
- Main IPC: B23K35/26
- IPC: B23K35/26 ; C22C13/00 ; B23K1/19 ; C22C9/06 ; B23K35/30 ; B23K1/00 ; B32B15/04 ; B23K35/00 ; B23K35/02
Abstract:
A bonding material having a first layer containing Sn as a main component thereof and a second layer containing a metal having a higher melting point than that of Sn as a main component thereof, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between the Sn and the metal.
Public/Granted literature
- US20180297152A1 BONDING MATERIAL, AND BONDING METHOD AND BONDED STRUCTURE EACH USING SAME Public/Granted day:2018-10-18
Information query
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