Invention Grant
- Patent Title: Laminate, integrated molding, and method of producing same
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Application No.: US15527196Application Date: 2015-11-10
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Publication No.: US10751957B2Publication Date: 2020-08-25
- Inventor: Takashi Fujioka , Masato Honma
- Applicant: Toray Industries, Inc.
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@729a756e com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@324bfd8
- International Application: PCT/JP2015/081560 WO 20151110
- International Announcement: WO2016/080238 WO 20160526
- Main IPC: B29C70/46
- IPC: B29C70/46 ; B29B11/12 ; B29C43/18 ; B32B5/28 ; B32B33/00 ; B29C45/14 ; B32B27/28 ; B32B27/30 ; B32B27/34 ; B32B27/08 ; B32B27/22 ; B32B27/36 ; B32B5/02 ; B32B27/20 ; B32B27/42 ; B32B3/26 ; B32B27/12 ; B32B27/32 ; B32B27/38 ; B32B27/26 ; B32B27/40 ; B32B7/12 ; B32B5/26 ; B29C43/20

Abstract:
A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.
Public/Granted literature
- US20170326820A1 LAMINATE, INTEGRATED MOLDING, AND METHOD OF PRODUCING SAME Public/Granted day:2017-11-16
Information query
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