A method for manufacturing a semiconductor device package includes providing an electrically insulating film having film terminal contacts on a surface thereof, and an opening therethrough. A semiconductor device arrangement at least including a carrier element having arranged thereon a projecting element and element terminal contacts is deposited on the film, wherein the projecting element is introduced into the opening and the element terminal contacts are arranged in contact with the film terminal contacts. The planarization layer is deposited over the carrier element and the film.