Invention Grant
- Patent Title: Method of bonding a metallic component to a non-metallic component using a compliant material
-
Application No.: US15979079Application Date: 2018-05-14
-
Publication No.: US10752557B2Publication Date: 2020-08-25
- Inventor: Benjamin T. Fisk , Grant O. Cook, III
- Applicant: UNITED TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Cantor Colburn LLP
- Main IPC: B23K20/00
- IPC: B23K20/00 ; C04B37/02 ; B23K20/02 ; B23K20/16 ; B23K20/233 ; B23K20/04 ; B32B7/04 ; B32B15/04 ; B23K103/16

Abstract:
A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.
Public/Granted literature
- US20180297900A1 Method of Bonding a Metallic Component to a Non-Metallic Component Using a Compliant Material Public/Granted day:2018-10-18
Information query