Invention Grant
- Patent Title: Resin composition containing surface-modified inorganic substance, thermally conductive material, and device
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Application No.: US16045712Application Date: 2018-07-25
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Publication No.: US10752778B2Publication Date: 2020-08-25
- Inventor: Keita Takahashi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@176ec5db
- Main IPC: C08L101/00
- IPC: C08L101/00 ; C08K9/04 ; C08G65/22 ; C01B21/064 ; C01B21/072 ; C08L63/00 ; C08G65/18 ; C01B21/068 ; C09K5/14 ; C08K5/1515 ; C08K5/55 ; C08K3/28 ; C08J5/18 ; C08K3/22 ; C08K5/14 ; C08K3/38

Abstract:
According to the present invention, there are provided a resin composition containing a surface-modified inorganic substance, which is obtained by performing surface modification on an inorganic nitride or an inorganic oxide by using a boronic acid compound, and an epoxy compound, a thermally conductive material including a cured substance of the resin composition, and a device including the thermally conductive material. The boronic acid compound has, for example, an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, or a carboxylic acid anhydride group. By using the resin composition of the present invention, it is possible to provide a thermally conductive material having excellent thermal conductivity and a device having high durability.
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