Invention Grant
- Patent Title: Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive
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Application No.: US15877791Application Date: 2018-01-23
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Publication No.: US10752816B2Publication Date: 2020-08-25
- Inventor: Akihiro Tabuchi , Tatsuya Inagaki
- Applicant: Nitto Shinko Corporation
- Applicant Address: JP Sakai-shi
- Assignee: NITTO SHINKO CORPORATION
- Current Assignee: NITTO SHINKO CORPORATION
- Current Assignee Address: JP Sakai-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59fd141a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@f5275e6
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J5/00 ; C08G59/24 ; C08G59/56 ; C08G59/50 ; C09J11/04 ; C08G59/02
Abstract:
Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.
Public/Granted literature
- US20180208810A1 REACTION-CURABLE ADHESIVE, ADHESIVE KIT, AND METHOD OF USING REACTION-CURABLE ADHESIVE Public/Granted day:2018-07-26
Information query
