- Patent Title: Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
-
Application No.: US15554872Application Date: 2016-01-27
-
Publication No.: US10753551B2Publication Date: 2020-08-25
- Inventor: Toshiaki Hasegawa , Kenichi Aoyagi , Yoshiya Hagimoto , Nobutoshi Fujii
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@53c115d1
- International Application: PCT/JP2016/052341 WO 20160127
- International Announcement: WO2016/143403 WO 20160915
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34 ; H01L23/00 ; F21K9/60 ; H01L21/683 ; H01L25/18 ; H01L25/04 ; F21Y113/13 ; F21Y115/10
Abstract:
An electronic component mounting substrate 10A is configured of an electronic component 20, and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10, a connection part 39 is exposed at the bottom of the concave part 24, and electronic component attachment parts 12 provided on the mounting substrate 10 are soldered to the connection parts 39 provided in the electronic component 20.
Public/Granted literature
- US20180045383A1 ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC COMPONENT MOUNTING METHOD Public/Granted day:2018-02-15
Information query
