Invention Grant
- Patent Title: Heat source unit
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Application No.: US16332149Application Date: 2017-07-24
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Publication No.: US10753640B2Publication Date: 2020-08-25
- Inventor: Fumiaki Koike , Shigeki Kamitani , Takuya Horita , Daiki Hirawa , Yuusuke Tanaka , Taichi Koshiji
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka-Shi
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6bd087f0
- International Application: PCT/JP2017/026613 WO 20170724
- International Announcement: WO2018/061426 WO 20180405
- Main IPC: F24F13/20
- IPC: F24F13/20 ; F24F1/10 ; F24F1/16 ; F24F1/22 ; F24F1/50 ; F24F1/56

Abstract:
A bottom frame (50) which constitutes a bottom surface of a casing (40) is divided into a main bottom frame (51) where a first compressor (11) is to be provided and a sub bottom frame (55) where a second compressor (21) is to be provided. The main bottom frame (51) is further divided into a first bottom frame (52) and a second bottom frame (53). The first compressor (11) is to be provided on the first bottom frame (52). A refrigerant circuit component (47) to be replaced or added in accordance with a capability or a function is to be provided on the second bottom frame (53).
Public/Granted literature
- US20190338985A1 HEAT SOURCE UNIT Public/Granted day:2019-11-07
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