A method of fabricating polymer modulators includes forming an insulating layer on a platform and depositing and patterning a ground electrode on the insulating layer. A bottom polymer cladding layer, a first blocking layer, a polymer core layer, a second blocking layer, and a top polymer cladding layer are deposited in order. A third blocking layer is deposited on the top cladding layer and patterned to define vias which are used to etch ground openings through the top polymer cladding layer, the second blocking layer, the core layer, the first blocking layer, and the bottom cladding layer to the ground electrode. The openings are filled with electrically conductive material from electrical communication with the ground electrode to a surface of the top polymer cladding layer. The third blocking layer is removed and electrical contacts are formed on the top polymer cladding layer in electrical communication with the electrically conductive material.