Invention Grant
- Patent Title: Coil electronic component
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Application No.: US15818151Application Date: 2017-11-20
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Publication No.: US10755847B2Publication Date: 2020-08-25
- Inventor: Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2553ab91 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b15ffa3
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F41/04 ; H01F27/255 ; H01F41/12 ; H01F27/29 ; H01F17/00 ; H01F17/04

Abstract:
A coil electronic component includes a support member and a plurality of insulating patterns supported by the support member. Each of the plurality of insulating patterns includes an innermost insulating pattern adjacent to a through-hole of the support member, an outermost insulating pattern on the opposing side of the insulating patterns, and a plurality of central insulating patterns between the innermost insulating pattern and the outermost insulating pattern. At least one of the plurality of central insulating patterns has its largest width at a lower surface thereof where it is in contact with the support member.
Public/Granted literature
- US20180261377A1 COIL ELECTRONIC COMPONENT Public/Granted day:2018-09-13
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