A taping electronic component array includes a tape including a long carrier tape, in which recesses are provided along a longitudinal direction, and a cover tape that is provided on the carrier tape to cover the recesses; and a first coil component and a second coil component, which are disposed in each of the recesses. The first coil component includes a first core and a first coil in which a first wire and a second wire are wound around the first core in a predetermined winding direction while twisted in a predetermined twist direction, and the second coil component includes a second core and a second coil in which the first wire and the second wire are wound around the second core in the predetermined winding direction while twisted in an opposite direction to the predetermined twist direction. Thus, degradation of manufacturing capacity is prevented.