Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16222640Application Date: 2018-12-17
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Publication No.: US10755977B2Publication Date: 2020-08-25
- Inventor: Jia-Chuan You , Chia-Hao Chang , Wei-Hao Wu , Yu-Ming Lin , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L29/66 ; H01L21/28 ; H01L21/311 ; H01L23/522 ; H01L21/033

Abstract:
A semiconductor device and a method for manufacturing a semiconductor device are provided. The semiconductor device includes a substrate, a gate stack, a gate spacer, a conductive feature, and a conductive cap. The substrate has a source/drain region. The gate stack is on the substrate. The gate spacer is alongside the gate stack. The conductive feature is on the source/drain region. The conductive cap is on the conductive feature and has a top in a position lower than a top of the gate spacer.
Public/Granted literature
- US20190139825A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-05-09
Information query
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