Invention Grant
- Patent Title: Shared contact structure and methods for forming the same
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Application No.: US16691801Application Date: 2019-11-22
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Publication No.: US10755978B2Publication Date: 2020-08-25
- Inventor: Leo Hsu , Sheng-Liang Pan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L27/11 ; H01L23/528 ; H01L29/66 ; H01L21/027

Abstract:
A butted contact structure is provided. In one embodiment, a structure includes a first transistor on a substrate, the first transistor comprising a first source or drain region, a first gate, and a first gate spacer being disposed between the first gate and the first source or drain region. The structure includes a second transistor on the substrate, the second transistor comprising a second source or drain region, a second gate, and a second gate spacer being disposed between the second gate and the second source or drain region. The structure includes a butted contact disposed above and extending from the first source or drain region to at least one of the first or second gate, a portion of the first gate spacer extending a distance into the butted contact to separate a first bottom surface of the butted contact from a second bottom surface of the butted contact.
Public/Granted literature
- US20200090999A1 Shared Contact Structure and Methods for Forming the Same Public/Granted day:2020-03-19
Information query
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