Invention Grant
- Patent Title: Laser processing method
-
Application No.: US16388209Application Date: 2019-04-18
-
Publication No.: US10755980B2Publication Date: 2020-08-25
- Inventor: Takafumi Ogiwara , Yuta Kondoh
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e24ae4c
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/046 ; B23K26/53 ; H01L21/268 ; H01L21/304 ; H01L21/683 ; H01L23/544 ; H01L21/02 ; B23K103/00

Abstract:
Laser light is converged at an object including a semiconductor substrate formed with a plurality of functional devices on a front surface, from a back surface of the semiconductor substrate, and while a distance between the front surface and a first converging point of the laser light is maintained at a first distance, whereby a first modified region is formed along the line. The laser light is converged at the object from the back surface, and while a distance between the front surface and a second converging point is maintained at a second distance, and while the second converging point is offset with respect to a position at which the first converging point is converged, whereby a second modified region is formed along the line. A predetermined portion including the back surface and at least the second modified region is removed.
Public/Granted literature
- US20190304839A1 LASER PROCESSING METHOD Public/Granted day:2019-10-03
Information query
IPC分类: