Invention Grant
- Patent Title: Cooling device and mounting method
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Application No.: US15786869Application Date: 2017-10-18
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Publication No.: US10755997B2Publication Date: 2020-08-25
- Inventor: Tomoyuki Mitsui
- Applicant: NEC CORPORATION
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c413917
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/467 ; H05K7/20
Abstract:
A cooling device comprises a frame and a heat radiating portion. The frame is mounted on a substrate, and includes a convex portion for cooling the substrate. The heat radiating portion is mounted on the frame at a position associated with a heating component located on the substrate. The convex portion assists positioning where the heat radiating portion is mounted.
Public/Granted literature
- US20180114738A1 COOLING DEVICE AND MOUNTING METHOD Public/Granted day:2018-04-26
Information query
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