Invention Grant
- Patent Title: Circuit assembly
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Application No.: US16197662Application Date: 2018-11-21
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Publication No.: US10756012B2Publication Date: 2020-08-25
- Inventor: Yuuichi Hattori , Yoshikazu Sasaki , Jun Ikeda
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Agency: Honigman LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7ea4e2ad
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/498 ; H05K5/02 ; H01L23/13 ; H05K7/14

Abstract:
A circuit assembly is provided. The circuit assembly includes: a first bus bar and a second bus bar that are part of a power circuit; and a control board to which a control circuit configured to control current flow in the power circuit is mounted, the circuit assembly including: a semiconductor switching element including a drain terminal and a source terminal that are connected to the first bus bar and the second bus bar, respectively, and a gate terminal configured to receive input of a control signal from the control circuit configured to control current flow in the power circuit; and a third bus bar configured to electrically connect the gate terminal and the control board.
Public/Granted literature
- US20190164878A1 CIRCUIT ASSEMBLY Public/Granted day:2019-05-30
Information query
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