Invention Grant
- Patent Title: Solid state imaging apparatus, production method thereof and electronic device
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Application No.: US16661648Application Date: 2019-10-23
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Publication No.: US10756218B2Publication Date: 2020-08-25
- Inventor: Kyohei Mizuta , Tomokazu Ohchi , Yohei Chiba
- Applicant: Sony Corporation
- Applicant Address: JP Toyko
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Toyko
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@423759d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@20ea7596
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L27/146 ; H04N5/357 ; H04N5/3745

Abstract:
A solid state imaging apparatus includes an insulation structure formed of an insulation substance penetrating through at least a silicon layer at a light receiving surface side, the insulation structure having a forward tapered shape where a top diameter at an upper portion of the light receiving surface side of the silicon layer is greater than a bottom diameter at a bottom portion of the silicon layer. Also, there are provided a method of producing the solid state imaging apparatus and an electronic device including the solid state imaging apparatus.
Public/Granted literature
- US20200058809A1 SOLID STATE IMAGING APPARATUS, PRODUCTION METHOD THEREOF AND ELECTRONIC DEVICE Public/Granted day:2020-02-20
Information query
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