Invention Grant
- Patent Title: Packaging structure
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Application No.: US16293426Application Date: 2019-03-05
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Publication No.: US10756296B2Publication Date: 2020-08-25
- Inventor: Zhaoli Chen , Jinfang Zhang , Lu Zhang
- Applicant: Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Applicant Address: CN Kunshan
- Assignee: Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Current Assignee: Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Current Assignee Address: CN Kunshan
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@58cfd61d
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/00 ; H01L27/32 ; H01L51/56

Abstract:
The present application discloses a packaging structure, the packaging structure includes a first substrate, a side of the first substrate including a power supply terminal; a second substrate; a metal extension layer, extending from the power supply terminal to both ends of the first side of the first substrate; and a packaging layer, covering the metal extension layer and fastening the first substrate and the second substrate.
Public/Granted literature
- US20190207143A1 PACKAGING STRUCTURE Public/Granted day:2019-07-04
Information query
IPC分类: