Invention Grant
- Patent Title: Solder hermetic sealing for OLEDs
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Application No.: US16176347Application Date: 2018-10-31
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Publication No.: US10756298B2Publication Date: 2020-08-25
- Inventor: John Hamer , Scott Stickel , Timothy Floyd Spencer
- Applicant: OLEDWorks LLC
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L23/00 ; B23K1/00

Abstract:
An OLED device comprising a substrate with a top surface; a first electrode covering the top surface of the substrate; a first insulating structure patterned over a portion of the first electrode where the pattern defines an inside area of the first electrode that is completely surrounded by the insulating structure, and an outside area of the first electrode not covered by the insulating structure; at least one organic layer for light emission within the inside area defined by the insulating structure; a second electrode over the at least one organic layer within the inside area defined by the insulating structure and at least partially over the first insulating structure; a cover slip located at least over the second electrode in the inside area defined by the insulating structure; and an electrically conductive solder seal making a hermetic seal between the insulating structure and the cover slip where the solder seal is in electrical contact with the second electrode. The insulating structure is desirably made of glass frit.
Public/Granted literature
- US20190140209A1 SOLDER HERMETIC SEALING FOR OLEDS Public/Granted day:2019-05-09
Information query
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