Invention Grant
- Patent Title: Millimeter-wave band communication device
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Application No.: US16308320Application Date: 2017-04-13
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Publication No.: US10756426B2Publication Date: 2020-08-25
- Inventor: Hideyuki Nagaishi , Akira Kuriyama , Takafumi Matsumura
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Applicant Address: JP Ibaraki
- Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee Address: JP Ibaraki
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36f2c591
- International Application: PCT/JP2017/015124 WO 20170413
- International Announcement: WO2017/217098 WO 20171221
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/42 ; H01Q1/52 ; H01Q13/02 ; H01Q19/06 ; H01P3/08 ; H01Q23/00 ; H01Q13/08 ; H01P5/08 ; H01P5/107 ; H05K9/00

Abstract:
Proposed is a millimeter-wave band communication device which does not generate spatial resonance in a cover shielding unnecessary radio waves from the outside.Disclosed is a millimeter-wave band communication device including: a substrate; a radio frequency circuit element for a millimeter-wave band provided on the substrate; and a cover made of a bulk material that covers at least a part of the radio frequency circuit element and a surface of the substrate, the cover being formed by blending a dielectric loss material in a base.
Public/Granted literature
- US20190190142A1 MILLIMETER-WAVE BAND COMMUNICATION DEVICE Public/Granted day:2019-06-20
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