Invention Grant
- Patent Title: Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil
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Application No.: US16235116Application Date: 2018-12-28
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Publication No.: US10757849B2Publication Date: 2020-08-25
- Inventor: Masahiro Watanabe
- Applicant: Tatsuta Electric Wire & Cable Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
- Current Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Potomac Law Group, PLLC
- Agent Kenneth Fagin
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2761ca56
- Main IPC: H05K3/06
- IPC: H05K3/06 ; H05K3/38 ; H05K9/00 ; H05K1/09 ; H05K1/02 ; H05K1/03
Abstract:
An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.
Public/Granted literature
- US20190150331A1 Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil Public/Granted day:2019-05-16
Information query
