Invention Grant
- Patent Title: Floor mat structure and floor mat assembly
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Application No.: US16195862Application Date: 2018-11-20
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Publication No.: US10758764B2Publication Date: 2020-09-01
- Inventor: Shih-Hsiung Yen , Chia-Hung Ou , Ta-Hsiang Huang , June-Peng Lai , Fu-Hsuan Tseng , Ching-Tai Chang
- Applicant: Shih-Hsiung Yen , Chia-Hung Ou , Ta-Hsiang Huang , June-Peng Lai , Fu-Hsuan Tseng , Ching-Tai Chang
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Main IPC: A63B6/00
- IPC: A63B6/00 ; F21V33/00 ; A61B5/11 ; H05B47/10 ; H05B47/105

Abstract:
A floor mat structure includes an upper cover, a plurality of light bars, a lower cover and at least one sensing element. The upper cover includes a main body and a plurality of indicator blocks. The main body has an upper surface and a lower surface opposite to each other. The indicator blocks are separated from one another and are disposed on the lower surface. The light bars are disposed on the upper cover and are embedded in the upper surface. The lower cover assembled to the upper cover includes a base and a plurality of bumps. The base has a configuration surface facing the lower surface. The bumps are separated from one another and are disposed on the configuration surface, wherein orthographic projections of the indicator blocks on the configuration surface does not overlap the bumps. The sensing element is disposed on the lower cover and are located at at least one bump. When the sensing element senses pressure from the upper cover, the light bars illuminate. Also, a floor mat assembly is provided.
Public/Granted literature
- US20190151697A1 FLOOR MAT STRUCTURE AND FLOOR MAT ASSEMBLY Public/Granted day:2019-05-23
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