Invention Grant
- Patent Title: Laminate molding apparatus
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Application No.: US15885826Application Date: 2018-02-01
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Publication No.: US10758980B2Publication Date: 2020-09-01
- Inventor: Ichiro Araie
- Applicant: Sodick Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: SODICK CO., LTD.
- Current Assignee: SODICK CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@690391f1
- Main IPC: B22F3/105
- IPC: B22F3/105 ; B22F3/24 ; B33Y10/00 ; C21D1/18 ; B33Y50/02 ; B33Y40/00 ; B33Y30/00

Abstract:
A laminate molding apparatus calculates three-dimensional finished shape data after displacements occurred after molding of the initial molded object are completed based on a molding program corresponding to three-dimensional shape data of a molded object to be created, compares the three-dimensional finished shape data of the initial molded object with three-dimensional shape data to calculate a correction data of the displacement, creates a corrected molding program corresponding to corrected three-dimensional shape data in which coordinates of the surface of the molded object to be created by adding the correction data to the three-dimensional shape data, and molds a corrected molded object under the same molding conditions as when the initial molded object is molded based on the corrected molding program.
Public/Granted literature
- US20180264550A1 LAMINATE MOLDING APPARATUS Public/Granted day:2018-09-20
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