Invention Grant
- Patent Title: Electrode chip attachment device
-
Application No.: US15700819Application Date: 2017-09-11
-
Publication No.: US10758995B2Publication Date: 2020-09-01
- Inventor: Yuhei Koyama
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6845d63e
- Main IPC: B23K9/28
- IPC: B23K9/28 ; B23K11/30

Abstract:
In an electrode chip attachment device, a guide member which is formed such that the guide member can be divided into a first half member and a second half member with a division surface that is passed though the communication hole and that is parallel to the axial direction and a coupling shaft serving as a separate mechanism which separates the first half member and the second half member from each other when the chip holder is pushed into the first tapered portion and the second tapered portion from the opposite side of the electrode chip and which passes the chip holder to the side of the electrode chip.
Public/Granted literature
- US20180071853A1 ELECTRODE CHIP ATTACHMENT DEVICE Public/Granted day:2018-03-15
Information query
IPC分类: