Invention Grant
- Patent Title: Method and apparatus for machining a component
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Application No.: US15754415Application Date: 2016-08-24
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Publication No.: US10759018B2Publication Date: 2020-09-01
- Inventor: Telikicherla Venkata Lakshmi Narasimha Rao
- Applicant: Sundaram-Clayton Limited
- Applicant Address: IN Chennai
- Assignee: Sundaram-Clayton Limited
- Current Assignee: Sundaram-Clayton Limited
- Current Assignee Address: IN Chennai
- Agency: Lee & Hayes, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@709473e1
- International Application: PCT/IN2016/050283 WO 20160824
- International Announcement: WO2017/033211 WO 20170302
- Main IPC: B24B31/116
- IPC: B24B31/116 ; B24C3/32 ; B24B31/00 ; B24B49/04

Abstract:
The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 μm to about 60 μm, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 μm.
Public/Granted literature
- US20180250791A1 METHOD AND APPARATUS FOR MACHINING A COMPONENT Public/Granted day:2018-09-06
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