Invention Grant
- Patent Title: Injection molding method and injection molding device for transparent resin molded article
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Application No.: US15952825Application Date: 2018-04-13
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Publication No.: US10759098B2Publication Date: 2020-09-01
- Inventor: Masahiro Bessho , Naomoto Ishikawa , Tsunetoshi Tanemura
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@762fb30b
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/00 ; B29C45/16 ; B29C45/26 ; B29K33/00 ; B29K69/00 ; B29L9/00 ; B29L31/30

Abstract:
The present invention effects a reduction in production cost and increases yield of a transparent resin molded article and prevents the generation of defects such as bubbles, weld lines, and sink marks. This injection molding device (2A) for a transparent resin molded article is equipped with: a die (3) for injection molding the transparent resin molded article; and a gate (5) that is provided to the peripheral edge of the die (3) and that is the inlet through which a resin material (R) is injected into the die (3). The thickness dimensions (Ta) of the die (3) are in the range of 15-25 mm, and the ratio of the diameter dimensions (D) of the gate (5) to the thickness dimensions (Ta) of the die (3) is set in the range of 1:6 to 1:3.
Public/Granted literature
- US20180229409A1 INJECTION MOLDING METHOD AND INJECTION MOLDING DEVICE FOR TRANSPARENT RESIN MOLDED ARTICLE Public/Granted day:2018-08-16
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