Invention Grant
- Patent Title: Electronic component unit and wire harness
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Application No.: US15869158Application Date: 2018-01-12
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Publication No.: US10759358B2Publication Date: 2020-09-01
- Inventor: Ryo Nakano , Yukihiro Koyama
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e699244
- Main IPC: B60R16/02
- IPC: B60R16/02 ; B60R16/023 ; H02G3/16

Abstract:
An electronic component unit applicable to a wire harness includes: a plurality of blocks each including at least one main body portion to each of which an electronic component is attached, the blocks each including block-side joints for joining any two of the blocks to each other, the blocks being joined together via the block-side joints with the main body portions arranged side by side in a first direction with gaps between adjacent ones of the main body portions; and a supporting wall body including a plurality of wall-body side joints for supporting and fixing in a second direction intersecting the first direction, in a cantilever fashion, the blocks joined together via the block-side joints.
Public/Granted literature
- US20180229673A1 ELECTRONIC COMPONENT UNIT AND WIRE HARNESS Public/Granted day:2018-08-16
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