Invention Grant
- Patent Title: Molding compound, method for the preparation of said molding compound, electronic component, and motor vehicle
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Application No.: US16096942Application Date: 2017-05-09
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Publication No.: US10759932B2Publication Date: 2020-09-01
- Inventor: Reiner Nico Behrendt
- Applicant: Volkswagen Aktiengesellschaft
- Applicant Address: DE Wolfsburg
- Assignee: VOLKSWAGEN AKTIENGESELLSCHAFT
- Current Assignee: VOLKSWAGEN AKTIENGESELLSCHAFT
- Current Assignee Address: DE Wolfsburg
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@179357e5
- International Application: PCT/EP2017/060976 WO 20170509
- International Announcement: WO2017/202596 WO 20171130
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08L63/00 ; C08L67/06 ; H01B3/40 ; H01B3/44 ; C08L61/28 ; C08L79/08 ; C08L23/10
Abstract:
The invention relates to a molding compound (100) for electronic components, comprising a plastic main matrix (10) into which a polypropylene plastic particles (11) having a beta-crystallite structure are introduced.
Public/Granted literature
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