Invention Grant
- Patent Title: Hall sensor
-
Application No.: US15815730Application Date: 2017-11-17
-
Publication No.: US10760981B2Publication Date: 2020-09-01
- Inventor: Tsuyoshi Akagi , Takaaki Furuya
- Applicant: Asahi Kasei Microdevices Corporation
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@71e806ff com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@13b7737c
- Main IPC: G01B7/14
- IPC: G01B7/14 ; G01D5/14 ; G01R33/06 ; G01L1/12 ; H01L27/22 ; H01L43/06 ; H01L43/14 ; G01B7/30 ; G01R33/07 ; G01R33/09 ; G01L3/10

Abstract:
A Hall sensor having a ball portion on a magnetosensitive portion is provided. A Hall sensor is provided, including: a substrate; a magnetosensitive portion formed on the substrate; an insulating film formed on the magnetosensitive portion; an electrode portion formed on the insulating film; and a ball portion which is provided on the electrode portion and is electrically connected to the electrode portion, wherein in plan view, a projection area of the ball portion accounts for 10% or more of a projection area of the magnetosensitive portion. The projection area of the ball portion may account for 20% or more of the projection area of the magnetosensitive portion. A bonding wire which is electrically connected to the ball portion and is extended from the ball portion in a direction perpendicular to an upper surface of the electrode portion may be further included.
Public/Granted literature
- US20180143090A1 HALL SENSOR Public/Granted day:2018-05-24
Information query