Disclosed is related generally to a contact for testing a semiconductor device and a socket device therefor. The contact of the present invention, being a spring contact configured in an integrated body by blanking and bending a metal board, includes: an elastic part composed of various strips in a fixed pattern, and sharp end parts provided on opposite ends of the elastic part, respectively. Preferably, with a filler having conductivity and elasticity being filled in space volume, the contact of the present invention has excellent durability and electrical characteristics. In addition, the test socket according to the present invention, being the rubber type adopting the above-stated contacts, provides an appropriate effect for a test of a semiconductor device having a fine pitch.