A semiconductor device includes a first integrated chip; a second integrated chip; a plurality of reference through-chip vias formed through the first and second integrated circuit chips; and at least a normal through-chip via formed through the first and second integrated circuit chips, wherein the first integrated circuit chip comprises: a plurality of reference sourcing circuits suitable for sourcing a reference current to the respective reference through-chip vias; and at least a sourcing circuit suitable for sourcing the reference current to the normal through-chip via, and wherein the second integrated circuit chip comprises: a plurality of reference sinking circuits suitable for sinking currents flowing through the respective reference through-chip vias; a line suitable for electrically coupling the plurality of reference through-chip vias; a comparison voltage generation circuit suitable for generating a plurality of comparison voltages based on a voltage of the line; at least a sinking circuit suitable for sinking a current flowing through the normal through-chip via; and a comparison circuit suitable for comparing the voltage of the normal through-chip via to the plurality of comparison voltages.