Invention Grant
- Patent Title: Method of fabricating a semiconductor device
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Application No.: US16458418Application Date: 2019-07-01
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Publication No.: US10762269B2Publication Date: 2020-09-01
- Inventor: Annie Lum , Derek C. Tao , Cheng Hung Lee , Chung-Ji Lu , Hong-Chen Cheng , Vineet Kumar Agrawal , Keun-Young Kim , Pyong Yun Cho
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F30/39
- IPC: G06F30/39 ; H01L27/088 ; H01L27/02 ; G06F30/398 ; G06F119/18

Abstract:
A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.
Public/Granted literature
- US20190325104A1 METHOD OF FABRICATING A SEMICONDUCTOR DEVICE Public/Granted day:2019-10-24
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