Invention Grant
- Patent Title: Laminated magnetic materials for on-chip magnetic inductors/transformers
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Application No.: US14950364Application Date: 2015-11-24
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Publication No.: US10763038B2Publication Date: 2020-09-01
- Inventor: Hariklia Deligianni , William J. Gallagher , Sathana Kitayaporn , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Joonah Yoon
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01F41/26
- IPC: H01F41/26 ; H01F41/04 ; H01F10/32 ; H01F5/00

Abstract:
A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.
Public/Granted literature
- US20170076860A1 LAMINATED MAGNETIC MATERIALS FOR ON-CHIP MAGNETIC INDUCTORS/TRANSFORMERS Public/Granted day:2017-03-16
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